In the era of Industry 4.0, manual quality checks are becoming obsolete. Automated Ultrasonic Testing (AUT) represents the pinnacle of Non-Destructive Testing (NDT), offering real-time integrity verification for smart card bonding, children's book assembly, and complex plastic packaging.
Unlike traditional methods, our ultrasonic systems utilize high-frequency acoustic waves to detect internal flaws, delamination, and bonding inconsistencies without damaging the product. This is critical for high-value RFID and SIM card production.
Our technology bridges the gap between massive volume and meticulous quality. With speeds reaching 30,000 pcs/hour, the integration of ultrasonic sealing and testing ensures every unit meets global rigorous standards.
Years Experience
Pcs/Hr Output
NDT Accuracy
Sqm Factory
Shenzhen, China, has evolved into the "Silicon Valley of Hardware." Wentong Machinery, located in the heart of the Guangming District, leverages this ecosystem to provide:
From SIM card punching to ultrasonic magnetic tape laying, we provide end-to-end lines for financial and telecommunication cards.
Specialized machines for board book mounting, gluing, and die-cutting for children's durable book production.
Ultrasonic sealing solutions for high-speed filter paper production and automated card packaging systems.
Established in 2008, Wentong has over 20 years of experience in developing and manufacturing of smart card machines and post-press equipment. We have been committed to constantly growing and improving our products and service to meet all our customer’s requirements for production of children’s books, board books, paper cards and plastic cards.
Our factory is located in Guangming District, Shenzhen, China. It covers an area of about 5,000 square meters. The workshop is divided into processing area, assembly area, machine display area and product display area. Strict implementation of the 5S standard allows employees to work in a safe and comfortable space. The company has a professional R & D team, experienced assembly engineers, skilled electricians and fitters.
A: Ultrasonic sealing creates a molecular bond without the need for adhesives, reducing consumable costs and increasing recycling potential. It is faster, cleaner, and more consistent for high-speed card packaging.
A: Yes, our modern automated lines feature smart PLC interfaces that can be integrated with factory-level monitoring for real-time data tracking.
A: We use high-precision servo motors and optical fiber sensors to ensure that every cut is within a 0.1mm tolerance, vital for SIM card and magnetic stripe applications.
A: We offer 1-year warranty, video guidance for maintenance, and can dispatch engineers to your site for installation and training services.
The global demand for sustainable packaging and secure identity cards is driving factories to adopt automated ultrasonic solutions. We see a significant trend in:
As contactless payments rise, the need for machines that can handle delicate chips without heat damage (using ultrasonic) is surging.
Procurement teams are looking for "Plug-and-Play" modules that can be swapped between card punching, collating, and packaging roles.
Automated ultrasonic testing helps identify defects early in the line, preventing wasted materials in subsequent processing steps.